| HDB 32650 System Board |
| Specification |
Description |
| Processor |
Intel® Pentium® III up to 1GHz+ (w/256K L2 cache)
Intel® Celeron™ up to 850MHz (w/128K L2 cache) |
| Socket |
Socket 370 |
Core Logic Chip Set
(North Bridge) |
Intel® 82815
Graph and Memory Controller Hub
Support PC100/PC133 DRAM
Support ACPI 1.0
Support dynamic power down of SDRAM
Support AGP 2X |
Core Logic Chip Set
(South Bridge) |
Intel® 82801
I/O controller hub
Support two IDE channels
Support ATA 33/66, Ultra DMA 33/66
Support 256 bytes RTC |
CPU Host Bus Speed
(Front Side Bus) |
100/133 MHz |
| Memory |
Support SDRAM up to 512M bytes
PC100/PC133 compliant |
| VGA controller |
Intel® 82815 embedded
Support AGP 2X 64 bit engine
Support H/W 3D engine
Support motion compensation
Supports DVMT |
| Super I/O |
Support FDD controller
Support 16550A UART
Support 8042 KBC controller |
| System Monitor |
On board system monitoring controller
7 voltage probes
1 FAN tachometer
2 Temperature probes |
| Communication |
Two Intel® 82559
10/100 Base TX support full duplex
Compliant with PCI V2.1, IEEE802.3, IEEE 802.3U
RJ45 connector x 2 |
| HDD |
Support 2.5" IDE HDD
Support Ultra DMA 33/66
Support ATA 33/66 |
| I/O Expansion |
One 32bit PMC connector
1. 10/100Base-T LAN x 1 + 160 SCSI PMC x 1 PMC
2. 10/100Base-T LAN x 3 PMC |
| Dimension |
388 (W) x 117 (H) mm |
| Power Requirement |
5V Max 8A+
3.3v Max 2A
+12V Max 800mA
-12v Max 20mA |
| Environment |
Operating temperatures: 0°C to 45°C
Storage temperatures: -20°C to 80°C
Relative humidity: 10% to 90% (Non-condensing) |
| Regulation |
CE
FCC class A |
