
Effective Date: April 29, 2010
| Phase-out Model | Replacement Model |
| ECK-161BSF-WD/CM440/1GB | ECK-161BWD-R20/CM440/1GB |
| ECK-161BSF-WD/T5500/1GB | ECK-161BWD-R20/T5500/1GB |
| EBC-2100-R30 | EBC-2100-R40 |
| EBC-2101-R10 | EBC-2101-R20 |
| IBX-500A/256MB | IBX-500BW-R20/LX800/256MB |
| IBX-500A/512MB | IBX-500BW-R20/LX800/512MB |
| IBX-530-945GSE-R10/N270/1GB | IBX-530B-R20/N270/1GB |
| IBX-530W-945GSE-R10/N270/1GB | IBX-530BW-R20/N270/1GB |
| IBX-600-945GSE-R10/N270/1GB | IBX-600A-R20/N270/1GB |
| IBX-600-945GSE-UPS-R10/N270/1GB | IBX-600A-UPS-R20/N270/1GB |
| IBX-650A-R10/512MB | IBX-650B-R20/852GM/512MB |
| IBX-650AW-R10/512MB | IBX-650BW-R20/852GM/512MB |
Reason for Changes
Change the power adapter to the one with ERP and PSE certificates

Product(s) Affected: FOX-150/120/122 series
Date Effective: 2010.01.01
Description and Purpose of Change to the Customer:
1. Due to high sunlight readability and competitive costs of LCD Optical bonding processing, it is required to phase in the bonding process in the gap between LCD and Touch screen/Glass. Please see attached drawing below for reference:

2. Engine board Change: The engine board of New version P/N will be changed to newest version as well after PCN.
Bonding processing has benefits as below :
10 GigaBit,1U,24 Port,45nm,4U,60950 Standards,AAEON,Access Control,Acrosser,ACT-08A,Adlink,Advanced Mezzanine Card,Advantech,AEC-6831,AEC-6850,AEC-6910,AEC-6920,Aerospace,AFL-F08A,anti-vibration,AR-B1631ET,Arbor Technology,AR-ES0631ET,ATX,Automation Computer,Available Stock,Axiomtek,Blu-ray,Calibration,chipset,COM Express,Core 2 Duo,Corewind,Corvalent ,Curtiss Wright,Demarcation,Digital Signage,Earthquake,ECN-381B,embedded pc,embedded system,EM-MIFARE,End of Life,EOL,EPIC,Ethernet,ETX,ETX-204A,EVOC,extended temperature,extreme conditions,Factory,fanless,Fastwel,Five Nines,FOX-120,FOX-122,FOX-150,GFR1K5,GM45,Hardware Load Balance,harsh conditions,High Definition,high temperature,Hot Swappable,i7,iBase,IEI Technology Corp,Industrial,Industrial Automation,Industrial Computing,industrial display,Industrial Electronics,Intel,Intel 910GMLE,Intel 945GSE,Intel Atom,Intel EA,Intel Embedded Alliance,Intel Sandy Bridge,Intel Xeon ,Interface Masters,Japan,KISS,KONTRON,LCD Display,Lifecycle,low power,low temperature,LTE eNodeB,MDD,Media Center,Media Server,Medical Power Supply,MicroATX,military,Mini-Box PC,Mini-ITX,Mobile,Multimedia Box,Niagara 4224,NodeB,NORCO China,Panel PC,PC,PC/104,PCI-951,PCN,Pentek,PICMG 1.0,PICMG 1.3,Pico-ITX,Power Supply,Press Release,Product Announcements,Production,R10IA7T,Rackmount Chassis,RAD,Repair Service,RFID Reader,Rockwell Automation,rugged,Semi F47 Compliancy,Service Agreements,Service Center,Single Board Computer,SUMIT-104,SUMIT-EPIC,SVGA,System,Tektronix,TF-AEC-7450,Total Power,Touch Screen,TPMPU63,Traffic Distribution,Tsunami,VersaLogic,VIA Technologies,Vox Technologies,VoxShield,Warranty Program,Wi-Fi,Wincomm,Windows,Winmate,Wynmax,x86,XMC Module,XP Power
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